JPS629728Y2 - - Google Patents
Info
- Publication number
- JPS629728Y2 JPS629728Y2 JP1981066438U JP6643881U JPS629728Y2 JP S629728 Y2 JPS629728 Y2 JP S629728Y2 JP 1981066438 U JP1981066438 U JP 1981066438U JP 6643881 U JP6643881 U JP 6643881U JP S629728 Y2 JPS629728 Y2 JP S629728Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- adhesive
- frame
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981066438U JPS629728Y2 (en]) | 1981-05-07 | 1981-05-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981066438U JPS629728Y2 (en]) | 1981-05-07 | 1981-05-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57178446U JPS57178446U (en]) | 1982-11-11 |
JPS629728Y2 true JPS629728Y2 (en]) | 1987-03-06 |
Family
ID=29862478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981066438U Expired JPS629728Y2 (en]) | 1981-05-07 | 1981-05-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS629728Y2 (en]) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0735389Y2 (ja) * | 1986-07-09 | 1995-08-09 | ソニー株式会社 | 半導体装置 |
JP3580082B2 (ja) * | 1997-04-22 | 2004-10-20 | 株式会社村田製作所 | チップ状部品の実装構造および実装方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5529241Y2 (en]) * | 1974-08-05 | 1980-07-11 | ||
JPS5343477A (en) * | 1976-09-30 | 1978-04-19 | Nec Corp | Semiconductor device |
-
1981
- 1981-05-07 JP JP1981066438U patent/JPS629728Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS57178446U (en]) | 1982-11-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2006005333A5 (en]) | ||
JP2000049171A (ja) | 接着剤と封入剤の同時硬化によるエレクトロニックパッケ―ジの製造方法 | |
JP2006100752A (ja) | 回路装置およびその製造方法 | |
JPS629728Y2 (en]) | ||
JP4591362B2 (ja) | 電子装置の製造方法 | |
JPH0817855A (ja) | 半導体装置の製造方法およびこれに用いられる積層体 | |
JPS6127182Y2 (en]) | ||
JP3721589B2 (ja) | 混成集積回路装置及びその製造方法 | |
JP2998484B2 (ja) | 半導体装置用リードフレーム | |
JPH01164044A (ja) | チップ実装方法 | |
JP4408015B2 (ja) | 半導体装置の製造方法 | |
JP2520429B2 (ja) | 電子部品実装用プリント配線板 | |
JPH01272125A (ja) | 半導体装置の製造方法 | |
JPS6228762Y2 (en]) | ||
JPS6334281Y2 (en]) | ||
JPH0358541B2 (en]) | ||
KR100515101B1 (ko) | 반도체패키지의 제조 방법 및 그 반도체패키지 | |
JPH0582060B2 (en]) | ||
JPS6115580B2 (en]) | ||
TW511258B (en) | Substrate-on-chip packaging process | |
JPS62117349A (ja) | 電子部品封止用キヤツプとその製造方法 | |
JPH06268094A (ja) | 混成集積回路 | |
JPS61287127A (ja) | 電子素子用チツプキヤリアの製造方法 | |
JPH06163747A (ja) | 混成集積回路装置 | |
JP2000174039A (ja) | 半導体装置及びその製造方法 |